Thick copper substrate
By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!
We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.
- Company：松和産業 本社
- Price：Other
